Associated industrialists and marketers say that additional cost saving accrue if commercial and industrial stakeholders utilize the step by step processes of wafer reclaiming several times over. The repeat processes are possible alongside of the wafer reclaiming services‘ ability to provide thousands of wafers on any given day of production. Quick turnarounds are for one day only, but in spite of this, the processes of wafer reclaiming are intricate and there are a number of inspection tests to get through before redistributing reclaimed wafers worldwide.
Centralized and well-managed inspections contribute towards further cost containment for the industrialist and, of course, the maintenance of fully centralized inventory control. Today’s wafer inventories are now being reclaimed through the use of computerized management systems. And in as little as eight processing steps, no less than three inspections have been detected. The first step is to receive used wafers from the customers. One of the last steps before wafers are delivered to the customers is that of a visual inspection.
The first inspection explores the current condition of the received wafers. Before wafers are polished, a second inspection takes place. This is done after pre-sorting procedures have removed film and sorting in accordance with thickness has been done, as well as the complete cycles of stripping and etching. These cycles utilize chemical processing whereby pre-existing patterns and films are removed from the wafers. By the time all wafers are ready for polishing, only the best equipment will be used.
The objective is to achieve a prime test wafer surface. Low removal polishing technology ensures that only a few microns are removed at a time. After polishing work is completed, a cycle of clean spinning, rinsing and drying is entered into. Two cleaning processes are used, during which particles are being removed.